Wafer Handling Robots Proves Advantageous In Various Fields

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Semiconductor equipment has a huge burden of equipment front-end module designs which result in less tool productivity. Without doubt, semiconductor manufacturing spans various stages and is a complex process. A huge emphasis is laid upon cost as well as quality in semiconductor equipment. 300mm FOUP proves effective in various wafer mapping procedures.

Wafer handling robots are best in the business as they offer accuracy as well as repeatability. In manual wafer handling, there is an increased workload which can only be solved by Wafer handling robots. Wafer handling robots provide a logical approach to decrease the manual workload.

Current wafer handling robots can pick and place 300mm wafers in a sequence in a repeated manner. Wafers are picked and placed based on the location of the joint. A typical sequence involves

•    Extend to wafer pick location
•    Pick wafer
•    Retract to a safe position
•    Extend arm to place location
•    Place wafer
•    Repeat

Tasks are performed in a series by a wafer handling robots to make sure the robot has reached the point where it has been directed to go. To increase the output, the main focus of robot manufacturers is to decrease the time consumed in each process.

Features Of Wafer Handling Robots

Wafer handling robots complete the task in an efficient manner which otherwise consumes plenty of time manually. They are extremely precise and have the ability to complete the task in minimum time. By monitoring the electrical overhead and by safety scanning, collisions are avoided.

Wafer handling robots have observed significant advancements- high throughput and superior performance are some of the features which make wafer handling robots a favorite of manufacturing firms.

The commands are fairly easy to learn; with some research, they can be self-learned. These robots are equipped to identify fault and recovery which make them a preferred choice of the industries.

Wafer mapping sensors are trouble-free to maintain, easy and safe to use. They reduce the manufacturing cost significantly as they improve efficiency. The assimilated barcode reader or the off-axis reader along with the direct optical algorithm of the entire involved axis tends to the recurrence of wafer placement. This trait makes wafer mapping one of the best in the competition. To analyze data wafer handling software is widely used.

300mm FOUP offers a robust design and amazing sealing capability. It offers secure and clean wafer transport, integration and optimum automation at an effective cost. To analyze data wafer handling software is widely used.

Location: Dublin, CA 94568, USA

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