Kensington Labs

The complexity in the outsourced assembly and test (OSAT) the industry is blowing up owing to higher functionality demand, longer battery life, and thinner forms in handheld devices. OSAT factories are readily using complex packaging technologies for blurring the line between wafer packaging and wafer processing. Through Wafer Automation we are able to meet the challenges of various wafer-level architectures, like modern wafer fabrication. The traditional packaging methods are no longer relevant; wafer automation has taken up the transition. The fabrication life cycles, characteristics, and activities have to be carefully learned before deploying in the OSAT environment. In this competitive wafer-level packaging (WLP) era, it is crucial to have higher-level manufacturing capabilities and engineering resources. Comparison Traditional OSAT production is relatively low-margin, and all the packaging services were in support of wafer requirements. The advanced packaging applications h

Shopping malls, hospitals, commercial buildings have automatic doors. Have you ever thought about their work? An Automatic Door Opener opens when you stand in front of it and closes automatically. This technology has made the entrance of many buildings easy. What Kinds Of Technologies Are Used In Making Them? There are many technologies used to make automatic doors. Radar sensors, Arduino bases, PIR sensors, and infrared sensors are most readily system in such doors. Working In the Arduino automatic door openers, motion-detecting sensors are used to open and close the door. The infrared energy released by the human body is detected by the PIR sensor and so the door function when someone approaches the door. The sensor changes when someone approaches the door and the Arduino UNO receives the signal accordingly. PIR Sensor- A Brief Description Pyroelectric or IR motion sensors notice the change in heat and the output pin changes accordingly. Everything when heated emi