Wafer Pre aligner- a Crucial Part of the Wafer Transmitting System

-
Wafer pre aligners are a very vital component in the manufacturing of wafers. It positions the wafers precisely before they are actually transferred onto the exposure platform. The positioning precision highly affects the exposure accuracy of the wafer and efficiency of the work in the whole manufacturing system.
These cs are used to accurately place the silicon wafers before photo-etching. As the precision requirement of machining is more than that of transportation of wafer, there is the need to position the wafers with wafer-pre aligner to balance the position error produced during the transportation. Due to the improvement of the manufacturing system of the wafer, it demands greater accuracy and speedy alignment of the wafer-pre aligner system.

Kensington automation offers high-speed type, non-contact type, a built-in controller, compact design, and provides one-chuck system wafer pre-aligners that are ready to meet the various client demands for the exterior colors and materials.

It supports various sizes of the wafers nearly up to 12 inches and it also corresponds to the chipping inspection.

The pre-aligners are classified into two different types namely mechanical and optical. In the mechanical type, it utilizes the mechanical structure to place the center of wafers, and its precision is too low to meet the high accuracy demands of today. On the other hand, the optical type is highly used in the pre-alignment of the wafers as it offers great position accuracy and satisfies the high precision requirements. As the optical type uses optical sensors as well as mechanical structure to meet the high accuracy position of a wafer that’s why it provides greater precision.

Comments

Post a Comment

Popular posts from this blog

Learning about Front Opening Universal Pod (FOUP)

-
Image
What is FOUP? The Front Opening Universal Pod or FOUP is the exclusive plastic enclosure used for handling the silicon wafers in a safe and secure environment. FOUP is also known by another name, Front Opening Unified Pod. The main purpose of this device is to designate the wafers in the machines for increasing the processing performance. FOUP opener is used to check for any abnormalities by opening the lid.  3000mm FOUP  was developed in the mid-1990s as the wafer processing tool. Many businesses design their FOUPs in various color combos, and the product sizes vary as per the brand. Also, FOUP, as well as IC processing equipment, can provide the nitrogen ecosystem for boosting the device productivity. Earlier, engineers were able to develop only the  300mm FOUP  with the detachable cassette, which was used to place the wafer in the right position. With the advancement in technology, 400 mm wafer FOUP load ports are easily accessible from the robotics laboratory. It allows th
Read more

A Detailed Study of FOUP, 300mm FOUP Load Port Wafer Handling Robot

-
Image
What is FOUP? The FOUP is defined as Front Opening Universal Pod, which is the exclusive plastic enclosure equipped for handling the silicon wafers in a safe environment. The other name of FOUP is the Front Opening Unified Pod. The primary purpose of this device is to allocate the wafers in the machines to increase the processing performance. In the mid-1990s, 3000mm FOUP was developed as the wafer processing tool. Many companies design their FOUPs in different color combos, and their product sizes also vary according to the brand. In addition, IC processing equipment and the FOUP can provide the nitrogen ecosystem to boost the device productivity. Previously, the engineers may only develop the 300mm FOUP with the detachable cassette to place the wafer in the right position. But now, 400 mm wafer FOUP load ports are also easily accessible from the robotics laboratory. It may allow the swapping of doors from front to bottom so that robot mechanisms can access the wafer from the FOU
Read more

Importance of FOUP in Semi-Conductor Industry

-
Image
What is the meaning of FOUP?  FOUP stands for Front Opening Universal Pod, and it is a particular plastic casing made to handle silicon wafers in a secure manner. The Front Opening Unified Pod is abbreviated as FOUP. The essential objective of this device is to better place wafers in the machines in order to raise the processing speed. The wafer processing equipment 300mm FOUP was first developed in the mid-1990s.     Many businesses make FOUPs in a variety of color combinations and the sizes of their product lines because it varies from industry to industry. Furthermore, the nitrogen ecosystem can be given by IC processing tools and FOUP to boost device outcomes. Previously, engineers could only construct the 300mm FOUP with the detachable cassette to position the wafer correctly. However, now the robotics laboratory has easy access to 400 mm wafer FOUP load ports. It may allow robot systems to reach the wafer from the FOUP by shifting doors from front to bottom. Furthermore, the FO
Read more