How the Wafer Front End and 300mm FOUP can help increase productivity?
Are you looking for leading-edge robotic automation? One must know that the wafers in a 300mm semiconductor fabrication facility are conveyed via the workshop I carriers, which are recognized as front opening unified pods (FOUPs). The primary performance measure is known in the work-in-process (WIP) with the repetitive cycle time. The batch tools such as the order arrival rate, the average order size, batching policy, and automated material handling system, and the other ones significantly affect the models' performance. Knowingly that the semiconductor production process is primarily split into the following procedures, which are generally known as front-end and back-end production, their operations also include complex and sophisticated steps. The wafer front end production was termed as the wafer fabrication, whereas the back end production gathers and tests different semiconductor devices. After the completion of the front-end production process, the wafers would be tra...